Centered around the key theme of how miniaturization and integration on the PC platform is accelerating the extension of the PC platform into new form factors, new usage models and new markets, thereby prompting the proliferation of digital intelligence, Mr Chen outlined VIA’s comprehensive strategy covering silicon, platform and system level innovation in driving the transition of the PC to devices with consumer electronics appeal.

‘These days, the industry is talking about performance per watt, which is important on a silicon level; however, we believe that the industry should be thinking of new metrics, such as features per square inch at the platform level, and functionality per pound at the mobile system level, or per litre for desktop systems,’ said Wenchi Chen, President and CEO, VIA Technologies, Inc.