The VIA CX700M integrates premium graphics, audio, memory, storage, and HDTV support all in a single chip design. This unified design enables the creation of smaller form factor designs, reduced power consumption, and easier cooling, all of which opens the door for an expanded range of embedded solutions. This is all done in a single chip package exactly the same size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34% in board real estate. This represents a major breakthrough for the embedded industry where ultra compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA mainboards.

Complementing the power-efficient VIA C7 and fanless VIA Eden processors it supports, the VIA CX700M is based on a highly sophisticated power efficient architecture that enables such rich integration into a compact package with a maximum power envelope of just 3.5 watts. A number of key power management technologies are incorporated that monitor activity and dynamically control power according to system load requirements.