SUNNYVALE, Calif. – May 2, 2007 – NVIDIA and Broadcom joined AMD (NYSE: AMD) to showcase the 3D graphics, wireless, battery life, and compute performance advantages of next-generation AMD mobile platforms at an event held in San Francisco today. Based on superior technologies from the AMD Better by Design program — including next-generation 65nm AMD Turion 64 X2 dual-core mobile technology, chipsets from AMD and NVIDIA, and leading wireless networking solutions from Broadcom — these mobile platforms deliver a superior Windows(tm) Vista experience for end-users.

AMD’s award-winning 65nm Silicon-on-Insulator technology provides increased transistor performance, scalability and power efficiency. AMD Turion 64 X2 dual-core mobile technology based on the 65nm process, now shipping, represents an important milestone as AMD continues its rapid conversion of Fab36. Notebook PCs based on the new AMD Turion 64 X2 dual-core mobile technology will be available later this quarter in designs from leading computer manufacturers.