The newest PC3-12800 modules feature OCZ’s Flex XLC (Xtreme Liquid Convention) heatsink that delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. This unique “flexible” design gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation, allowing the memory to operate at extreme speeds without the high temperatures that inhibit or damage the module’s ICs.
“Increasing clock frequency translates into a linear increase in power consumption and heat dissipation, and with DDR3 hitting doubling the frequency of DDR2, the memory technology is facing serious thermal challenges that require advanced solutions of heat management,” commented Dr. Michael Schuette, VP of Technology at OCZ Technology. “OCZ answers this challenge with the introduction of the Flex Series of heat spreaders to high speed, enhanced latency DDR3 to underscore the commitment to delivering the best overall memory solution with the flexibility to utilize advanced air or water-cooled systems.”