Sunnyvale, CA – November 6, 2007 – OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the ReaperX memory series, aninnovative memory solution that utilizes highly effective heat transfer technology. Re-engineering the Reaper HPC (Heat Pipe Conduit) design, the DDR2 PC2-6400 ReaperX uses a dual metal heatpipe formation to effectively offload heat and increase stability of memory modules. The unique ReaperX heatspreader is designed to deliver superior heat dissipation that is more effective than traditional heatspreaders.

As part of the award-winning OCZ HPC family, the ReaperX memory series is built with the same aim of optimal heat dissipation for the best possible overclocking environment for enthusiasts. Through leading-edge cooling technology and engineering, ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme efficiency due to a new dual copper heat pipe design. Each memory chip is in direct contact with a thermo-conductive pipe that guides the performance robbing heat away from key memory components and quickly dissipates it through the aluminum fin array

OCZ Technology Introduces the ReaperX Series, the Ultimate Combination - Memory  1