The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC3-16000 Flex II memory module features this breakthrough thermal management technology from OCZ that combines an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs to effectively dissipate heat produced by high-speed memory. This sophisticated series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
“A data rate of 2GHz was unthinkable only a year ago,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Power consumption and heat generation directly follow the operating frequency; therefore, the thermal dissipation of these modules exceeds any specifications of the original design and requires the most advanced thermal solution that will reliably work under any conditions. Whether in a water-cooling environment or else under air-cooling conditions, the legacy of the Flex series continues with the Flex II design as the most advanced memory cooling solution for the fastest modules out there.”
