The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC2-9200 Flex II memory module features this breakthrough thermal management technology from OCZ. Combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs, Flex II effectively dissipates heat produced by high-speed memory. This sophisticated series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
“One of the side effects of extreme memory speeds is an increase in performance robbing heat, and the new Flex II modules are among the most powerful memory solutions in the market place yet are able to remain cool and stable with an innovative new cooling design,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “The thermal power is addressed using what we believe is the most advanced memory cooling solution currently available, suited for either liquid or air cooling system configuration to unleash the full power of 4 GB of DDR2 at the highest possible frequency.”