“IBM Researchers, in collaboration with the Fraunhofer Institute in Berlin, demonstrated a prototype that integrates the cooling system into the 3-D chips by piping water directly between each layer in the stack.
These so-called 3-D chip stacks – which take chips and memory devices that traditionally sit side-by-side on a silicon wafer and stacks them together on top of one another — presents one of the most promising approaches to enhancing chip performance beyond its predicted limits.”
Here is some more Tech News from around the web:
- RepRap universal constructor achieves self-replication @ Hack a Day
- Firefox 3 tryout launched @ The Inquirer
- Researchers Tout New Network Worm Weapon @ Slashdot
- They say it got smart: a 2008 review of the PS3 @ Ars Technica
- HP – Elite Autofocus Webcam Review @ TechwareLabs
- QNAP NVR-1012 Wireless Network Surveillance Kit @ Benchmark Reviews
- Home Decor for Absolute Geeks @ Creative Closeup
- Phoronix Media Releases Linux-Based Testing Platform for Hardware, Software Validation
The research being done at IBM into cooling stacked or 3-D chips is focusing on water. They have managed to pipe water into cooling structures as thin as a human hair (50 microns) between the individual chip layers. They are getting some impressive results, which you can read about over at [H]ard|OCP.