Event organizers Computex Taipei and the Taiwan Design Center selected iF International Forum Design GmbH to preside over the award ceremony, with an international jury comprising experts in industrial design judging the 139 entries on the basis of their technology, innovation, design and international sales potential.
“VIA is extremely pleased to receive this prestigious award for design and innovation,” commented Richard Brown, Vice President of Marketing, VIA Technologies, Inc. “It certainly validates our efforts to take the VIA OpenBook to the next level of style and customization.”
VIA has brought a unique “open” approach to the individualization and customization of the VIA OpenBook mini-note reference design by making the CAD files of the external panels for the VIA OpenBook available for download directly from the dedicated website: www.viaopenbook.com.
The mini-note market is the fastest growing segment of the mobile PC industry, and the VIA OpenBook ushers in the next generation of mini-note designs. Powered by VIA’s ultra-mobile processor platform, comprising the VIA C7-M ULV processor paired with the VIA VX800 unified digital media IGP chipset, the VIA ultra mobile platform brings fans of the mini-note revolution unrivalled broadband connectivity, superior video and audio playback and stunning graphics, all packaged in a sleek, highly portable, clamshell form factor.
Where to See the VIA OpenBook Mini-Note Reference Design
For those of you lucky enough to be in Taipei this week drop by the VIA hospitality suite, room 201D in the Taipei International Convention Center, for a first-hand look and feel of this new generation of mini-note devices. The VIA OpenBook mini-note reference design will also be on show in Microsoft’s mini-note display on their booth G236 located in Hall 3 of the Taipei World Trade Center.
Click here to watch a video of the VIA OpenBook being put through its paces by Richard Brown, VP of Marketing, on the open roads of sunny California.