Now featuring native S-ATA II support, Gigabit LAN, and support for GPIO, SM bus and LPC devices, the 10cm x 7.2cm VIA EPIA P700 is based on the VIA VX700 unified digital media IGP chipset and is powered by a 1GHz VIA C7 or fanless 500MHz VIA Eden ULV processor. An integrated power adapter coupled with the 5-volt S-SATA power cable negates the need for a separate power daughterboard, saving considerable space for ultra compact systems.
Linear on-board pin-header placement means developers can use a single cable to effortlessly connect various I/O devices in a streamlined way that reduces cable clutter. Flexible battery placement is also geared towards improved miniaturization, making the VIA EPIA P700 the most slimline Pico-ITX board yet.
Two companion boards make light work of design implementation and product testing. The P700-A board features an RJ45 port, a VGA port and a COM port, while the P700-B sports four USB ports and three audio jacks for multi-channel surround sound. The two companion boards fit seamlessly with the streamlined linear pin-headers on either side of the VIA EPIA P700 to enable ultra low profile devices.
“VIA has listened to its customers to learn how we can add even greater features to our products,” said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. “Pico-ITX continues to evolve in tandem with the needs of our customers, addressing the challenge of producing full-featured, ultra compact embedded systems that can be brought to market as quickly and as easily as possible.”
