A Detailed Look at the Inside
Removing the two side panels provides a good look inside the Spedo full-tower enclosure. As we mentioned earlier, the inside of the Advance Package edition features all-black interior surfaces along with four removable plastic baffles that make up the A.T.C.3 thermal management system.
Essentially these baffles are partitions that separate the internal case area into different zones with their own airflow (PSU, HDDs, motherboard, etc). In practice I found the A.T.C.3 baffles to be more trouble than they were worth but each user should evaluate their potential and decide for themselves. You don’t have to use all four, so just using one or two might meet your needs.
There are seven 5.25” exposed drive bays located down the front of the Spedo enclosure. One 3.5” drive adapter comes bundled with the case if you have a card reader or other 3.5” device to mount. The 5.25” bays feature screw-less retention mechanisms that are convenient and functional but not as secure as using machine screws to mount devices.
Looking up into the motherboard area you can see the single 230mm exhaust fan on the top along with two 120mm exhaust fans on the rear panel. There are a total of 7 expansion slots and each slot cover is held in place with a tool-less quick releases latching mechanism. All of the PCI slot covers are louvered for added airflow.
The motherboard tray uses brass standoffs and includes mounting holes for ATX and M-ATX form factors. One unique feature the Spedo Advanced Package has to offer is the placement of an optional 120mm fan on the back side of the motherboard tray to help cool the backside of the motherboard CPU area. (The extra 120mm fan that is included with the Advance Package can be mounted here if desired).
The lower section of the Spedo enclosure contains six 3.5” HDD bays in two removable cages. Individual HDDs are mounted in separate plastic trays that just slide out when released and use a screw-less retention mechanism; more on this in the next section.
The Advance Package also includes cable management on the backside of the motherboard tray (C.R.M.3), which consists of square plastic pieces.