Recently, AMD launched two new AMD Embedded G-Series APUs (Accelerated Processing Units). The two new chips have a TDP rating of 5.5 and 6.4 watts, which represent a 39% improvement in power savings over the previous iterations. The 361mm² chip package is capable of being used in embedded systems without the need for a fan to cool it. The embedded chips include one or two low power x86 Bobcat processors and a discrete class DirectX 11 GPU on a single die.
AMD currently has three systems utilizing the new APUs, including a Pico-ITX form factor computer, a Qseven form factor computer, and a digital sign system. Buddy Broeker, the Director of Embedded Solutions for AMD stated that "today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement."
The two new chips are named the T40R and the T40E. The chips both run at 1.00GHz; however, the 6.4 watt TDP T40E is a dual core chip and the 5.5 watt TDP T40R is a single core variant. Both chips include an AMD Radeon 6250 GPU, a 64KB L1 cache, and a 512KB L2 cache per each CPU core. Further, the chips feature an integrated DDR3 memory controller that can support up to 667MHz solder-down SODIMMs or two DIMM slots. More details on the series as a whole can be found here.
Mobile and embedded processors continue to get smaller and faster. Have you seen any AMD powered embedded technology in your town?