At 10 million 8-inch equivalent wafers produced in 2010 and an expected 20 million by 2015 it is a good thing that not only is TSMC not having major production issues anymore but it also ahead schedule with the setup of Fab 15, which will be producing 28nm chips on 12 inch wafers. Moving from 8 to 12 inches should also mean less cost per chip, though whether the savings will be absorbed by the costs of the new fab or if they will be passed straight on to the consumer is a question that cannot be answered until summer next year when they expect to get production capacity up to full speed. DigiTimes has the scoop here.
"Taiwan Semiconductor Manufacturing Company (TSMC) has begun equipment move-in for the phase 1 facility of a new 12-inch fab (Fab 15) with volume production of 28nm technology products slated for the fourth quarter of 2011, according to the foundry.
TSMC previously said it would begin moving equipment into the facility in June, and expected volume production to kick off in the first quarter of 2012.
Pilot runs at the phase 1 facility of Fab 15 are expected to start in the third quarter of 2011, following by volume production in the fourth quarter, said Jason Chen, senior VP of worldwide sales and marketing for TSMC, at a company event held on May 5. With new capacity coming online, TSMC will see its combined 12-inch capacity top 300,000 units a month."
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