Custom case manufacture HDPLEX recently introduces two new fanless cases with the H3.TODD and H5.TODD. Both cases support mini-ITX motherboards and would blend well into your home AV rack. The fanless chassis are constructed of 6063T aluminum and come in powder coated black or brushed aluminum silver. The H3.TODD and H5.TODD are cases that also double as CPU heatsinks by way of copper heatpipes that carry heat away from the processor into the aluminum case. Both can support processors up to 75W TPDs without requiring fans.
Both the H3.TODD and H5.TODD are compatible with LGA 775, 1155, and 1156 Intel processors and AMD AM2, AM3, FM1, and FM2 chips. Further, the cases come with a single USB 3.0 port on the front. HDPLEX will also include a power supply and IR reciever with the cases for an additional fee.
The H3.TODD measures 325 x 298 x 60mm and weighs 12.5 lbs (5.5 kg). The case supports mini-ITX motherboards, 3.5” hard drives, and 12.7mm optical drives.
On the other hand, the H5.TODD is a wider case that can support both Mini-ITX and Micro-ATX form factor motherboards as well as a single full height PCI-E expansion card. The case measures 325 x 438 x 60mm and is a total of 16 lbs (7.5kg) by itself.
The H3.TODD is available for pre-order now for $248 while the H5.TODD is currently in stock for $275. Pre-orders for the H3.TODD should being shipping on January 25, 2013.
You can find more photos of the cases on the HDPLEX website.