The L-shaped integrated heat pipe cooling solution cools the CPU power circuitry just above and to the right of the CPU socket.
The heat pipe cooler is made up of 2 different thin-finned aluminum heat sinks, interconnected via heat conducting tubing (heat pipes). MSI uses thermal tape for interfacing between the power circuitry and the heat sinks.
The 12 SFC power phase chips are located below and to the left of their tied MOSFET chips, which make up the CPU's power plant.
The Southbridge chipset is passively cooled by a low-profile aluminum cooler with two attachment points to the board.
The Intel Z77 chipset cooler is a low-profile, thin finned aluminum based passive heat sink. The top of the heat sink is comprised of a two layer design with the board's dragon mascot outlined in the black metal overlay. MSI uses thermal paste to interface the cooler's surface with the chipset's.
The Intel Z77 chipset is reminiscent of a naked CPU die. The heat sink overlaps a good area around the chipset to better dissipate the generated heat. The heat sink itself is held in place by two screws underneath opposite corners of the chipset.