Intel has just lowered their lowered thermal expectations for Haswell if, of course, you use SDP as your metric. Scenario Design Point (SDP), as opposed to Thermal Design Power (TDP), describes how much heat dissipation is required for the product at some, usually underclocked, performance target. SDP does not need to affect burst performance, however, as the chip can still up-clock given some extra headroom.
While we don't know OEM partners, Intel could be green, with HP Envy?
It describes long-term cooling requirements, not instantaneous power draws.
In terms of SDP, Intel expected to ship 6W products based on their 4th generation core architecture. Today, Intel announced a limited stock will dip below that target, capable of just 4.5W in waste heat. OEMs who purchase from this limited binning will be able to include Haswell in even thinner active or passively cooled designs.
Intel has not described exact specifications, partners, or shipping dates.