The Register has obtained a slide describing the next families of Xeon processor to be released by Intel, the Purley platform which includes Skylake. There are some interesting new developments, including on die interface for either 10Gb/sec Ethernet or 100Gb/sec Omni-Path fabrics which interested the participants at the HPC conference the slides were shown at. They also mentioned a brand new memory architecture which is described as offering four times the capacity and 500 times the speed than current NAND, all at a lower price per chip which is likely to be somewhat of an exaggeration on their part. There were also new Phi chips, including the long awaited Knights Landing and workstation chips for use outside the server room.
"A presentation given at a conference on high-performance computing (HPC) in Poland earlier this month appears to have yielded new insight into Intel's Xeon server chip roadmap.
A set of slides spotted by our sister site The Platform indicates that Chipzilla is moving toward a new server platform called "Purley" that will debut in 2017 or later."
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