PC Perspective Podcast #350 – 05/21/2015
Join us this week as we discuss AMD's plan for HBM, IPS G-SYNC, GameWorks and The Witcher 3, and more!
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Hosts: Ryan Shrout, Jeremy Hellstrom, Josh Walrath, and Allyn Malventano
Program length: 1:24:12
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Week in Review:
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News item of interest:
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Hardware/Software Picks of the Week:
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Sebastian: Aukey Quick Charge 2.0 Portable Charger
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Closing/outro
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Same as last week…Waiting
Same as last week…Waiting for this show all week (and Last Week) expecting at least a comment on the issue with SSD losing data reported by Extremetech (http://www.extremetech.com/computing/205382-ssds-can-lose-data-in-as-lit…) The news dominated the SSD and hard drive conversations across the web all week and NO mention or comments from PCPer… what gives? I don’t even see a comments on the site!… oh well maybe the entire staff is on vacation! 🙁
Love your shows, we count on you for the truth.
This is almost a non issue
This is almost a non issue since who is going to use SSDs for cold storage – especially PCPer audience – virtually no one.
Exactly – Virtually, no one.
Exactly – Virtually, no one. – Reality, a lot of people.
Many worry about dropping a HDD and lose all their data. I’ve seen some throw — literally — their drives around in their bags and such. Some even knocks or drops books on their drives during a backup process. 🙁
looks like most of the PCper
looks like most of the PCper audience there are not old HD on a shelf somewhere with old data that is older than a year… really? I have HDs that are 15 years old that I went back to find missing data… but I guess I’m the only one.
But those are hard drives.
But those are hard drives. The topic was about SSD’s and the technology alone hasn’t been well established to fully verify the claims. A lot of people thought the report was over-exaggerated. Perhaps when SSD’s and HDD’s match capacity and price neck and neck. Right now SSD’s have a very clear use and HDD’s are slipping into a long-term, mass capacity, cold storage tape world.
HDD’s also have issues with bit rot when left unpowered for years. That’s why it’s recommended to power on even a rarely used drive at least once every year or two to prevent data loss just from magnetic slippage.
Josh, -5 geek points for not
Josh, -5 geek points for not immediately knowing ARM was Acorn previously, especially for someone living in a country with a monarch 🙂
Wait… Obama is a monarch?
Wait… Obama is a monarch?
Just replace hand waving with
Just replace hand waving with golf and you’re pretty much there. American royalty, who knew!
Hey Josh, AMD is still
Hey Josh, AMD is still thinking very hard about the idea of breaking up the SoC and stacking the different pieces, I guess either on an Interposer or vertically (3D), combining them to a multi-die SoC.
Have a look at that presentation from Semicon China (p. 28)
http://www.semiconchina.org/downloadFile/1428378823486.pdf
That would be great for
That would be great for high-end parts. Maybe we will get it with AMD’s CPU core redesign. If you put a CPU and a gpu on the same transposer then they could have wide interconnect almost as if they are on the same die.
That is an option they are
That is an option they are likely looking at. The bad thing about making an APU is that you have to make compromises on the process. The process needs for a GPU are significantly different for that of a CPU. AMD leaned more towards good GPU performance rather than CPU with the latest Kaveri APUs.
The same slide presentation
The same slide presentation shows how much more area efficient their CPU components are on the more gpu oriented high density process. The number of applications which are CPU limited for the consumer have been shrinking for a while. For the low-end and mid-range consumer market it probably makes more sense to use a larger number of lower powered small cores. This would be similar to Xbox one and PS4, except it would perform a lot better with more powerful CPU cores, a more powerful gpu, HBM, and DX12. At 14 nm, they could probably have at least a 4 core/8 thread APU with plenty of room for the gpu on the same die.
For the high-end, it probably would be most efficient to share the implementation with server products, which would mean separate CPU and gpu with optimized processes for both. They could really get some high core counts for servers if they put multiple CPU die on an interposer. It seems like they could probably use the same interconnect to connect a CPU or gpu, but this may require a different gpu design from lower end parts. Interconnect via the interposer does not take up that much die space compared the pcb routed interfaces, so perhaps they could have it present, but not routed on other products. Multi-gpu would be interesting; it would probably need to be smaller chips than current high-end gpus due to space constraints, unless they make larger interposers. I could see that as a possibility on smaller processes which have yield problems. You could probably have 2 or 4 separate gpu chips which could be interconnected enough to share memory and act more like a single gpu. You could get much better yields with 100 or 200 square mm die rather than a single giant die.
Enough rampant speculation, or maybe not. Josh (you, if Josh is reading this) mentioned something he can’t talk about. I am wondering if this is an Intel or Nvidia response to what AMD is doing with interposers and HBM. I feel like Nvidia has the 980 Tii, but there doesn’t seem to be anything else, unless there will be an nvidia chip with integrated cpu or something.
A mobile APU would be a compelling product though. Is Intel going to be releasing a more powerful version of their crystalwell part? The logical evolution of their mobile part without using interposers would be to put a separate CPU and gpu on a package with memory chip(s). I have considered their IGP dies to be somewhat strange since they are very far from square. It may not matter that much with small die, but it will make a difference with larger die. The same rules apply to Intel, and they have been making their IGPs on a process skewed towards high performance CPUs. I doubt that will remain competitive. They could stick with the IGP though, and just add more memory chips; Intel probably has sufficient fab capacity waste some space.
Whatever it is, this is the most interesting the PC hardware market has been in a while.
Allyn, if you listen to the
Allyn, if you listen to the broadcast you might not like how many times you say “like,” and almost never when it is appropriate. The host of a podcast of this nature should be free to speak informally with a liberal use of slang, but not free to perpetuate the demise of the English language as it is spoken in the USA.
I remember when I watched
I remember when I watched PCPer Podcast for the first time, I was wondering who is this fifth guy talking. LOL. I think you should start introducing yourself, Ken. Come on, don’t be shy. ;P
pay no attention to the man
pay no attention to the man behind the cam, what you thought you heard was actually the planet Venus.
it looks like I’m gona be
it looks like I’m gona be working during the live cast most of the summer, are you gona be able to handle it without me? lol. CANCEL THE INTERNET!
I have this honest feeling
I have this honest feeling Ryan is avoiding being on the podcast purposely. Perception is reality 😛
my boss was searching for TX
my boss was searching for TX 50-244 last month and encountered a website that has lots of sample forms . If you are looking for TX 50-244 also , here’s a
https://goo.gl/W4Z7ON.