A delivery of GPUs and related test equipment from Taiwan to Banglore has led to speculation about NVIDIA's upcoming GP104 Pascal GPU.
Image via Zauba.com
How much information can be gleaned from an import shipping manifest (linked here)? The data indicates a chip with a 37.5 x 37.5 mm package and 2152 pins, which is being attributed to the GP104 based on knowledge of “earlier, similar deliveries” (or possible inside information). This has prompted members of the 3dcenter.org forums (German language) to speculate on the use of GDDR5 or GDDR5X memory based on the likelihood of HBM being implemented on a die of this size.
Of course, NVIDIA has stated that Pascal will implement 3D memory, and the upcoming GP100 will reportedly be on a 55 x 55 mm package using HBM2. Could this be a new, lower-cost part using the existing GDDR5 standard or the faster GDDR5X instead? VideoCardz and WCCFtech have posted stories based on the 3DCenter report, and to quote directly from the VideoCardz post on the subject:
"3DCenter has a theory that GP104 could actually not use HBM, but GDDR5(X) instead. This would rather be a very strange decision, but could NVIDIA possibly make smaller GPU (than GM204) and still accommodate 4 HBM modules? This theory is not taken from the thin air. The GP100 aka the Big Pascal, would supposedly come in 55x55mm BGA package. That’s 10mm more than GM200, which were probably required for additional HBM modules. Of course those numbers are for the whole package (with interposer), not just the GPU."
All of this is a lot to take from a shipping record that might not even be related to an NVIDIA product, but the report has made the rounds at this point so now we’ll just have to wait for new information.