Flexible computers are quickly becoming more of a reality as researchers continue to find ways to make generally brittle components such as processors and memory out of new materials. This latest research has discovered new materials to construct RRAM which allow working memory to remain viable even when subjected to flex. Instead of using traditional CMOS they have found certain tungsten oxides which display all of the properties required for flexible memory. The use of those oxides is not new, however they came with a significant drawback; in order to fabricate the material you needed a larger amount of heat than for CMOS. Nanotechweb reports on new developments from a team led by James Tour of Rice University which have lead to a fabrication process which can take place at room temperature. Check out their article for an overview and link to their paper.
"Researchers in the US and Korea say they have developed a new way to make a flexible, resistive random access memory (RAM) device in a room-temperature process – something that has proved difficult to do until now."
Here is some more Tech News from around the web:
- Microsoft is going to roll up all your Windows 7 and 8.1 updates Windows 10-style @ The Inquirer
- TSMC to make chips for iPad coming out in 2017, says report @ DigiTimes
- Minecraft meets Oculus Rift VR on Windows 10 @ The Inquirer
- White hat pops Windows User Account Control with log viewer data @ The Register
- Microsoft: Why we had to tie Azure Stack to boxen we picked for you @ The Register
- Windows 10 Anniversary Update – Heaven for Power Users @ Hardware Secrets
- NVIDIA Pascal Mobile GPU Specifications & Details! @ TechARP