Flexible computers are quickly becoming more of a reality as researchers continue to find ways to make generally brittle components such as processors and memory out of new materials.  This latest research has discovered new materials to construct RRAM which allow working memory to remain viable even when subjected to flex.  Instead of using traditional CMOS they have found certain tungsten oxides which display all of the properties required for flexible memory.  The use of those oxides is not new, however they came with a significant drawback; in order to fabricate the material you needed a larger amount of heat than for CMOS.  Nanotechweb reports on new developments from a team led by James Tour of Rice University which have lead to a fabrication process which can take place at room temperature.  Check out their article for an overview and link to their paper. 

"Researchers in the US and Korea say they have developed a new way to make a flexible, resistive random access memory (RAM) device in a room-temperature process – something that has proved difficult to do until now."

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