SK Hynix have created an impressive die which has 72 layers of TLC 3D NAND. The storage density of their chips are somewhat lower than the competition, this particular chip sports 256Gb of capacity. This is due to the larger size of SK Hynix's cells, which has the benefit of allowing more layers than other manufacturers have been able to successfully create. The Register was told that compared to the previous generation of 48 layer NAND you could expect to see up to a 20% increase in read and write speeds, another benefit to their new process. To think, it was just a year ago that Al first introduced us to what 3D NAND would mean to the PC industry.
"Korean flash fabber SK Hynix has built a 72-layer 3D NAND die with 256Gb capacity. That number of layers, in effect a higher-rise flash chip than anybody else has built, is impressive but the 256Gb capacity is not; Toshiba's 64-layer flash die has a 512Gb capacity. Like the SK Hynix chip, it is a TLC (3bits/cell) device. It started sample shipping in February."
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- PC In A Mouse @ Hack a Day