Internals and Roundup Contenders

Internals

Outside things are nice and sturdy, though a bit on the larger side for what is only holding an M.2 form factor part plus an adapter PCB and Intel TB3 controller.

Lots going on inside. There are several thermal pads and a relatively large aluminum heatsink (right). Since the housing is plastic, the chunk of aluminum acts more as a simple thermal mass, which levels out the impact of short bursty loads placed on the X5.

The M.2 PCB layout and components are identical to the 970 EVO. Green PCB though.

Contenders

We grabbed a suitable round of competing products, including the Samsung T5 (USB 3.1 Gen1), TEKQ Rapide (TB3), MyDigitalSSD's Boost (USB 3.1 Gen2), and a generic JMS583 equipped NVMe to USB 3.1 (Gen2) adapter, fresh off the slow boat from China.

Ken already popped open the TEKQ Rapide in his review, so I opened only the parts that we needed to know the comparison SSDs for this article. It seemed fitting to go with a 970 EVO 1TB to match the X5, and the Boost is equipped with a pair of 250GB SATA 850 EVOs in RIAD-0.

« PreviousNext »