Is the Era of Intel Wi-Fi 6 AX200-Equipped AMD Boards Coming to an End?
Your next high-end AMD motherboard (or laptop) might not rely on an Intel Wi-Fi chip, as last week MediaTek and AMD announced their “collaboration to co-engineer industry leading Wi-Fi solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset”.
The new wireless solutions are slated to appear next year, presumably along with the next iteration of the Ryzen platform. Quotes from the press release follow:
The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals.
To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe and USB interfaces for modern sleep states and power management, which are vital elements of modern customer experiences. Further, the optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.
Filogic 330P supports the latest connectivity standards of 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz), along with Bluetooth 5.2 (BT/BLE). The high throughput chipset is ultra-fast with support for up to 2.4Gbps connectivity, including support for the new 6GHz spectrum at 160MHz channel bandwidth. The chipset also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint which enables the Filogic 330P chipset to be embedded in laptops of all sizes.