Intel’s Glass Substrates, A Whole New Way To Crack Cores

Source: Serve The Home Intel’s Glass Substrates,  A Whole New Way To Crack Cores

Silicon And Glass Make A Good Match

Intel are looking to make major changes to their chip designs with a plan to move from organic to glass substrates.  It will be quite a while before your desktop will see chips built with the new process, servers and AI chips will be the first to benefit from the new design.  While Intel have provided proof of concept chips using glass, we will likely be into the 2030’s before finished products start shipping to customers.

The benefits Intel suggests glass substrates will offer are impressive, including improved power delivery and a higher interconnect density.  They also expect that glass substrates can be laid out in thinner layers than organic ones which will extend the life of current EUV lithography, and that the ability to work at higher temperatures than with organics will offer a number of advantages.  The properties of glass substrates should allow for larger packages as well as higher yields than current materials, not to mention adding optical interconnects significantly easiser.

Drop by Serve The Home for more details.

Intel is announcing a new process change that will happen, it says, in the next decade. If you purchase a CPU these days, you are most likely purchasing a chip that is on an organic substrate. In the future, Intel is planning to use a glass substrate that better matches silicon properties.

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About The Author

Jeremy Hellstrom

Call it,, or PC Perspective, Jeremy has been hanging out and then working with the gang here for years. Apart from the front page you might find him on the BOINC Forums or possibly the Fraggin' Frogs if he has the time.

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